The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP works on innovative solutions in the fields of vacuum coating, surface treatment as well as organic semiconductors. The core competences electron beam technology, sputtering and plasma-activated deposition, high-rate PECVD as well as technologies for the organic electronics and IC/system design provide a basis for these activities. Thus, Fraunhofer FEP offers a wide range of possibilities for research, development and pilot production, especially for the processing, sterilization, structuring and refining of surfaces as well as OLED microdisplays, organic and inorganic sensors, optical filters and flexible OLED lighting. Our aim is to seize the innovation potential of the electron beam, plasma technology and organic electronics for new production processes and devices and to make it available for our customers.
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OLED microdisplay with embedded optical fingerprint sensor
Fraunhofer FEP has developed an OLED microdisplay with embedded optical fingerprint sensor. The display is built from nested display and sensor pixels and is based on the OLED-on-Silicon technology. In this setup the active area can show and capture images in the same plane. The first prototype has a native resolution of 1600dpi. This is 3 times higher than required from the FBI and allows the detection of 3rd level features of identification.
Full plastic transparent white OLED
OLED technology is nearly independent of the substrate they are processed on. Beside rigid glass OLED can be processed on flexible substrates like polymer webs, metal strips and thin flexible glass. Such flexible OLED modules allow much more freedom of design for integration into curved surfaces. In the last years the Fraunhofer FEP has developed fabrication technologies for OLED devices by sheet-to-sheet and roll-to-roll processing on different type of flexible substrates.
Micropatterning OLEDs using electron beam technology
Fraunhofer FEP has developed a novel approach to pattern the emission area of an OLED at high resolution. The technology uses an electron beam process, which takes place after finalizing the OLED including the encapsulation. The energy of the electrons determines their penetration depth in the layer stack. The encapsulation can also be penetrated by the electron beam and the luminous characteristics of the organic layers beneath will change without destroying the encapsulation itself.
Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik FEP
Phone: +49 351 2586-0
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