ROFIN-BAASEL Lasertech GmbH & Co.KG
We have been developing and manufacturing lasers and laser systems for material processing since 1975. In the core areas of marking, cutting, welding, micro-structuring and perforating, we are one of the leading manufacturers worldwide.
In the area of beam sources, we develop and manufacture lamp-pumped and diode-pumped solid-state lasers, and, for selected special applications, CO2 lasers. In the area of system solutions, we deliver turn-key systems for marking, cutting, welding and micro-structuring.
Our special engineering provides single-source, customized solutions. Here, project management, mechanical design, control technology, and laser integration are all handled by in-house specialists - so the customer receives a single-source solution.
LASER PROCESSING OF GLASS AND OTHER
TRANSPARENT BRITTLE MATERIALS
Laser processing of glass and other transparent brittle materials provides unmatched advantages compared to conventional production methods. Laser processing of glass is contact-free as the laser is a tool that doesn’t wear out. ROFIN provides laser sources and complete system solutions as well as processes tailor-made to the customer’s needs. Customers benefit from ROFIN’s broad application know-how to find the right solution for their specific needs.
SmartCleaveTMFI - IP protected laser cutting process
The ROFIN SmartCleaveTMFI process utilizes ultrashort-pulsed lasers with dedicated properties, e.g. the Burst Mode. The basic invention is a patented process using laser filamentation to separate brittle and transparent materials in a high-speed, quasi debris-free and zero-gap process and nearly no post-processing. The patent portfolio is expanded continuously by ROFIN.
laser glass cutting with SmartCleave
Laser processing of glass and other transparent brittle materials provides unmatched advantages compared to conventional production methods. ROFIN provides laser sources and complete system solutions as well as
processes tailor-made to the customer’s needs.
The SmartCleave process utilizes ultrashort-pulsed lasers with dedicated properties (patented process using laser filamentation).
High demand for laser processes for brittle materials
Glass and other brittle, transparent materials offer unique properties, that will fuel a continuously growing use in consumer electronics, medical devices, integrated circuits, architectural, automotive, aerospace and a variety of other interesting market segments. Driven by the constant need to reduce the number of processing steps, the amount of waste material and the use of water in production, the market is strongly pushing laser manufacturers and laser system integrators to offer alternatives to conventional mechanical technologies. Especially micro processing tasks, like cutting and drilling, are in need of more precise and less water-consuming technologies.
ROFIN SmartCleave™ FI shows outstanding cutting results
Beside the fusion cutting technology using pulsed fiber lasers especially for sapphire and ceramics, ROFIN’s SmartCleaveTM FI laser filamentation process has created a huge interest in the market, as the combination of achievable processing speed, edge quality (roughness, straightness, surface damage), material thickness range and material universality is just outstanding. Since the first presentation of this technology at the Glasstec2014, many industrial mass, but also several niche market applications have been realized successfully.
The ROFIN SmartCleaveTM FI filamentation process allows for cutting arbitrary shapes without taper into transparent and brittle materials of 0.05 to 12 mm thickness. The resulting surface finish is basically free of chipping. Typical surface roughness values less than one micron lead to high bending strengths of the cut parts. At sufficient internal stress levels, like present in chemically or thermally strengthened glass, the filamentation zone is separating automatically. Non-strengthened glass (e.g., but not limited to, soda lime, borosilicate and alumino-silicate), sapphire or ceramics can easily be separated by low mechanical or thermal force, for example, provided by a CO2-laser heating process.
Phone: +49 8105 3965-0
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